Product image Figure : HP Z240 Small Form Factor Workstation System board Specification Description System board form factor ATX 24.38 x 24.38 mm (9.6 x 9.6 in) Processor socket Single LGA 1151 CPU bus speed DMI Chipset Intel PCH C236 Memory expansion slots 4 DDR4 memory slots Memory type supported DDR4, UDIMM (unbuffered), ECC and non-ECC Memory modes Non-Interleaved for single channel. Interleaved when both channels are populated. Memory speed supported 2133MT/s DDR4 Memory protection ECC available on data Maximum memory 64 GB Memory configuration 4GB, 8GB and 16GB non-ECC/4GB, 8GB and 16GB ECC unbuffered DIMMs are supported. ECC and non-ECC memory DIMMs cannot be mixed on the same system. PCI express connectors 1 PCI Express Gen3 slot x 1 mechanical/ x 1 electrical (LP, half length) 1 PCI Express Gen3 slot x 16 mechanical/ x 16 electrical (LP, half length) 1 PCI Express Gen3 slot x 1 mechanical/ x 1 electrical (LP, half length) 1 PCI Express Gen3 slot x 16 mechanical/ x 4 electrical (LP, half length) NOTE: In the PCIe Gen3 (x 16 electrical/x 16 mechanical) slot, if it is not being used for a graphics card, only cards certified as After Market Options for this platform are supported. Supported drive interfaces SATA: Integrated (4) Serial ATA interfaces (6 Gb/s SATA). One port can optionally be used for eSATA. RAID 0 and 1 supported. Factory integrated RAID is Microsoft Windows only. RAID 5 is supported by Software XOR. Serial Attached SCSI: None. Integrated RAID: NOTE: Requires identical hard drives (speeds, capacity, interface) Integrated graphics: Intel HD Graphics 530 (on Core i3/i5/i7-6xxx processors); Intel Integrated Graphics for Xeon processors Based on Unified Memory Architecture (UMA) - a region of system memory is reserved and dedicated to the graphics display. Support for Microsoft DirectX 11, OpenGL 4.0 and OpenCL 1.2 on Intel HD Graphics P530 3 DP 1.2 graphics ports integrated in motherboard; Supports up to three simultaneous displays across DP outputs. Max resolution supported: 3840 x 2160 at 60Hz Network Controller: Integrated Ethernet PHY Connection I219LM. Management capabilities: WOL, PXE 2.1 and AMT 9 IDE connector: No Floppy connector: No Serial: 1 rear port 2nd Serial: Yes (optional serial port adapter kit required) Parallel: 1 internal header (optional parallel port adapter required) HD integrated audio: Yes USB Connectors Front: 2 USB 3.0, 2 USB 2.0 Rear: 6 USB 3.0 Internal: 1 USB 3.0, 2 USB 2.0 HD integrated audio Yes Flash ROM Yes Chassis fan header N/A Front control panel/speaker header Yes CMOS battery holder - lithium Yes Integrated trusted platform module Integrated TPM 1.2. Power supply headers Yes Power switch, power LED & hard drive LED header Yes Clear password jumper Yes Keyboard/mouse USB or PS/2 Operating voltage range 90-264 VAC Rated voltage range 100-240 VAC Rated line frequency 50-60 Hz Operating line frequency range 47-63 Hz Rated input current 4A at 100-240 V Heat dissipation Typical: 444 btu/hr (112 kcal/hr) Maximum: 890 btu/hr (224 kcal/hr) Power supply fan 70 mm x 70 mm x 25 mm 4-wire PWM ENERGY STAR qualified (config dependent) Yes FEMP standby power compliant Yes, with wake-on-LAN disabled: <2W in 55 - Power Off Surge tolerant full ranging power supply (withstands power surges up to 2000 V) Yes Hood lock header Yes DrP Lot 6- Tier 2 Compliance at 230 V Yes Environmental requirements Temperature: Operating: 5° to 35° C (40° to 95° F) Non-operating: -40° to 60° C (-40° to 140° F) Maximum altitude Operating: 3,000 m (10,000 ft) Non-operating: 9,100 m (30,000 ft) Humidity: Operating: 8% to 85% RH (non-condensing) Non-operating: 8% to 90% Shock Operating: 40 g, 2-3 ms, half-sine Non-operating: 160 cm/s, 2-3 ms, (~100g) Square: 422 cm/s, 20 g Cooling Above 1524 m (5,000 ft) altitude, maximum operating temperature is de-rated by 1° C (1.8° F) per 305 m (1000 ft) elevation increase. Physical security and serviceability Specification Description Access panel Tool-less Includes system board and memory information Hard drives Tool-less (internal bays) Expansion cards Tool-less Processor socket Tool-less, except for the processor heatsink Green user touch points Yes, on tool-less internal chassis mechanisms Color-coordinated cables and connectors Yes Memory Tool-less System board Screw-in Dual color power and HD LED on front of computer Yes. Configuration record SW Yes Over-temp warning on screen Yes Restore CD/DVD set Consists of an operating system DVD (OSDVD) and a driver DVD (DRDVD). OSDVD restores the original operating system. DRDVD will provide all drivers for the system. The DRDVD may also contain applications that originally shipped with the system for optional installation. Applications can also be obtained from HP.com. OSDVD and DRDVD are orderable with the system and available from HP Support. Dual function front power switch Yes, causes a fail-safe power off when held for 4 seconds Padlock support Yes (optional): Locks side cover and secures chassis from theft 0.22 in diameter padlock loop at rear of system Cable lock support Yes, Kensington Cable Lock (optional): Locks side cover and secures chassis from theft 3 x 7 mm slot at rear of system Universal chassis clamp lock support Yes (optional): Locks side cover and locks cables to chassis. Secures chassis from theft and allows multiple units to be chained together when used with optional cable Threaded feature at rear of system Solenoid lock and hood sensor Yes (optional) The Solenoid Hood Lock eliminates the need for a physical key by making the chassis lockable through software and a password. You can also lock and unlock the chassis remotely over the network. The Sensor Kit detects when the access panel has been removed. Rear port control cover Yes, locks rear IO cables to prevent cable theft Serial, parallel, USB, audio, network, enable/disable port control Yes, enables or disables serial, USB, audio, and network ports Removable media write/boot control Yes, prevents ability to boot from removable media on supported devices (and can disable writes to media) Power-on password Yes, prevents an unauthorized person from booting up the workstation Setup password Yes, prevents an unauthorized person from changing the workstation configuration NIC LEDs (integrated) (Green & Amber) Yes 3.3V aux power LED on system PCA No CPUs and heatsinks A T-15 Torx or flat blade screwdriver is needed to remove the CPU heatsink before the CPU can be removed. CPU removal is tool-less Power Supply Diagnostic LED No Front power LED Yes, white (normal), red (fault) Front hard drive activity LED Yes, white Front ODD activity LED Yes Internal speaker Yes System/emergency ROM flash recovery Recovers corrupted system BIOS Cooling solutions Air cooled forced convection Power supply fans 70 x 70 x 25 mm (2.75 x 2.75 x 0.98 in)4-wire PWM (non-serviceable) CPU heatsink fan Mainstream (<=65W): 93 x 86 x 75.8 mm (3.66 x 3.38 x 2.98 in) Performance: (<=95W): 93 x 102.7 x 75.8 mm (3.66 x 4.04 x 2.98 in) Chassis fan CPU heatsink fan also operates as the chassis fan. Memory heatsink fan No HP PC Hardware Diagnostics UEFI HP PC Hardware Diagnostics (UEFI) enables hardware level testing outside the operating system on many components. The diagnostics can be invoked by pressing F2 at POST, and is available as a download from HP Support. Access panel key lock No ACPI-ready hardware Advanced Configuration and Power Management Interface (ACPI). Allows the system to wake from a low power mode and controls system power consumption, making it possible to place individual cards and peripherals in a low-power or powered-off state without affecting other elements of the system Trusted platform module chip Yes Integrated chassis handles No Power supply Requires T15 Torx or flat blade screwdriver PCI card retention Yes, rear (all), middle (none), front (none) CMOS battery holder Yes DIMM connectors Yes Flash ROM Yes Diagnostic power switch LED on board Yes Clear password jumper Yes Clear CMOS button Yes BIOS Specification Description BIOS 32-bit services Standard BIOS 32-bit Service Directory Proposal v0.4 PCI 3.0 support Full BIOS support for PCI Express through industry standard interfaces.. ATAPI ATAPI Removable Media Device BIOS Specification Version 1.0. BBS BIOS Boot Specification v1.01. Provides more control over how and from what devices the workstation will boot. WMI support WMI is Microsoft's implementation of Web-Based Enterprise Management (WBEM) for Windows. WMI is fully compliant with the Distributed Management Task Force (DMTF) Common Information Model (CIM) and WBEM specifications. BIOS power on Users can define a specific day-of-week and time for the system to power on. ROM Based Computer Setup Utility (F10) Review and customize system configuration settings controlled by the BIOS System/emergency ROM flash recovery with video Recovers system BIOS in corrupted Flash ROM Replicated setup Saves BIOS settings to USB flash device in human readable file. Repset.exe utility can then replicate these settings on machines being deployed without entering Computer Configuration Utility (F10 Setup) SMBIOS System Management BIOS 2.7.1, for system management information Boot control Disables the ability to boot from removable media on supported devices Memory change alert Alerts management console if memory is removed or changed Thermal alert Monitors the temperature state within the chassis. Three modes: NORMAL - normal temperature ranges ALERTED - excessive temperatures are detected, raises a flag so action can be taken to avoid shutdown or provide for a smoother system shutdown. SHUTDOWN - excessive temperatures are encountered. Automatically shuts down the computer without warning before hardware component damage occurs. Remote ROM flash Provides secure, fail-safe ROM image management from a central network console. Updates can be performed before starting the OS. Updates can be periodically scheduled. ACPI (Advanced Configuration and Power Management Interface) Allows the system to enter and resume from low power modes (sleep states). Enables an operating system to control system power consumption based on the dynamic workload. Makes it possible to place individual cards and peripherals in a low-power or powered-off state without affecting other elements of the system. Supports ACPI 4.0 for full compatibility with 64-bit operating systems. Ownership Tag A user-defined string stored in non-volatile memory that is displayed in the BIOS splash screen. Remote Wakeup/Remote Shutdown System administrators can power on, restart, and power off a client computer ASF 2.0 Compliant No Instantly Available PC (Suspend to RAM - ACPI sleep state S3) Allows for very low power consumption with quick resume time Remote System Installation via F12 (PXE 2.1) (Remote Boot from Server) Allows a new or existing system to boot over the network and download software, including the operating system ROM revision levels Reports the system BIOS revision level in Computer Configuration Utility (F10 Setup). Version is available through an industry standard interface (SMBIOS) so that management SW applications can use and report this information System board revision level Allows management SW to read revision level of the system board. Revision level is digitally encoded into the HW and cannot be modified Start-up Diagnostics (Power-on Self-Test) Assesses system health at boot time with selectable levels of testing. Auto Setup when new hardware installed System automatically detects addition of new hardware. Keyboard-less Operation The system can be booted without a keyboard. Localized ROM Setup Common BIOS image supports System Configuration Utility (F10 Setup) menus in 12 languages with local keyboard mappings. Asset Tag The user or IT administrator to set a unique tag string in non-volatile memory. Per-slot Control Allows I/O slot parameters (option ROM enable/disable) to be configured individually. Adaptive cooling Control parameters are set according to detected hardware configuration for optimal acoustics. Pre-boot diagnostics (Pre-video) critical errors are reported via beeps and blinks on the power LED. Intel Active Management Technology (AMT) AMT 11.0; Allows workstation status to be monitored on a remote console Digitally and Cryptographically Signed BIOS Helps to prevent the installation of unauthorized versions of a BIOS (a rogue BIOS) from a virus, malware, or other code that could lead to compromised system security, data access, physical service, or even system board replacement. Master Boot Record Protection A feature in the HP BIOS that prevents changes and/or infections to the Master Boot Record. Useful in protecting from viruses. Boot Block Emergency Recovery Mode (BIOS Recovery) The HP BIOS offers a write-protected boot block ROM that provides recovery from a failed flashing of the computer BIOS. This special recovery mode prevents the system from becoming unusable or “bricked” when a BIOS update is interrupted. Industry Standard Revision Supported by the BIOS UEFI specification revision UEFI 2.4.0 ACPI Advanced Configuration and Power Management Interface, Version 4.0 ASF Alert Standard Format Specification, Version 2.0 ATA (IDE) AT Attachment 6 with Packet Interface (ATA/ATAPI-6), Revision 3b CD Boot ''El Torito'' Bootable CD-ROM Format Specification Version 1.0 EDD Enhanced Disk Drive Specification Version 1.1 BIOS Enhanced Disk Drive Specification Version 3.0 PCI Express PCI Express Base Specification, Revision 2.0 PCI Express Base Specification, Revision 3.0. PMM POST Memory Manager Specification, Version 1.01 Serial ATA II: Extensions to Serial ATA 1.0, Revision 1.0a Serial ATA II Cables and Connectors Volume 2 Gold SATA-IO SATA Revision 3.0 Specification SATA Serial ATA Specification, Revision 1.0a SPD PC SDRAM Serial Presence Detect (SPD) Specification, Revision 1.2B TPM Trusted Computing Group TPM Specification Version 1.2 (TPM 2.0 via Firmware Update) USB Universal Serial Bus Revision 1.1 Specification Universal Serial Bus Revision 2.0 Specification Universal Serial Bus Revision 3.0 Specification Manageability Specification Description Intel Active Management Technology (AMT) An advanced set of remote management features and functionality which provides network administrators the latest and most effective tools to remotely discover, heal, and protect networked client systems regardless of the system's health or power state. AMT 11.0 includes the following advanced management functions: Power Management (on, off, standby, reset) Hardware/Software Inventory (includes BIOS and firmware revisions Hardware Alerting Agent Presence System Defense Filters SOL (Serial Over LAN) ME Wake-on-LAN DASH 1.1 compliance IPv6 Support Fast Call for Help - a client inside or outside the firewall may initiate a call for help via BIOS screen, periodic connections, or alert triggered connection Remote Scheduled Maintenance - pre-schedule when the PC connects to the IT or service provider console for maintenance. Remote PCs can get required patches, be inventoried, etc by connecting to their IT console or Service Provider when it's convenient Remote Alerts - automatically alert IT or service provider if issues arise Access Monitor - Provides oversight into Intel AMT actions to support security requirements PC Alarm Clock Protected Audio Video Path (PAVP) Microsoft NAP Support Host Base set-up and configuration Management Engine (ME) firmware roll back Enhanced KVM resolution (Up to 4K) Intel vPro technology The HP Z240 workstations support Intel vPro technology when purchased with a vPro technology capable CPU: Intel Xeon processor family or 6th Generation Intel Core i5/i7 processors with Intel VT-d/VT-x and Intel TXT technology Service, support, and warranty Program to proactively communicate Product Change Notifications (PCNs) and Customer Advisories by email to customers, based on a user-defined profile. PCNs provide advance notification of hardware and software changes to be implemented in the factory providing time to plan for transition. Customer Advisories provide concise, effective problem resolution, greatly reducing the need to call technical support. Processors Specification Description Processors Intel CoreTM i7-6700 3.4 2133 4C CPU Intel CoreTM i7-6600 3.3 2133 4C CPU Intel CoreTM i7-6500 3.2 2133 4C CPU Storage/hard drives 500 GB SATA 7200 rpm 6 Gb/s 3.5 in HDD 1 TB SATA 7200 rpm 6 Gb/s 3.5 in HDD 2 TB SATA 7200 rpm 6 Gb/s 3.5 in HDD 3 TB SATA 7200 rpm 6 Gb/s 3.5 in HDD 500 GB SATA 7.2 K SED SFF HDD 1 TB SATA 7200 rpm 8 Gb/s 3.5 in SSHD (hybrid) 128 GB SATA 6 Gb/s SSD HP 256GB SATA 6Gb/s SSD HP 512 GB SATA 6Gb/s SSD HP 1 TB SATA 6Gb/s SSD HP 256GB SATA 6Gb/s SED SSD PCIe SSDs for HP workstations HP Z turbo drive G2 128 GB SSD HP Z turbo drive G2 256 GB SSD HP Z turbo drive G2 512 GB SSD Graphics Integrated Intel HD Graphics NVIDIA NVS 310 512 MB graphics NVIDIA NVS 315 1 GB Graphics NVIDIA NVS 510 2 GB graphics AMD FirePro W2100 2 GB NVIDIA Quadro K420 1 GB Graphics NVIDIA Quadro K620 2 GB Graphics NVIDIA Quadro K1200 4GB Graphics Optical and removable storage HP SD media card reader HP Thunderbolt 2 PCIe 1-port I/O card Networking and communications Integrated Intel I217LM PCIe GbE Controller (Intel vPro with Intel AMT 11.0) Supported drive interfaces Specification Description SATA Integrated (5) Serial ATA interfaces (6 Gb/s SATA). One port can optionally be used for eSATA. RAID 0 and 1 supported. Factory integrated RAID is Microsoft Windows only. Integrated graphics Intel HD Graphics 530 (on Core i3/i5/i7-6xxx processors) Intel Integrated Graphics for Xeon E3 processors Based on Unified Memory Architecture (UMA) - A region of system memory is reserved and dedicated to the graphics display. Support for Microsoft DirectX 11, OpenGL 4.0 and OpenCL 1.2 on Intel HD Graphics P530;. Supports up to three simultaneous displays across DP outputs. Max. resolution supported: 3840 x 2160 at 60Hz Network controller Integrated Ethernet PHY Connection I217LM. Management capabilities: WOL, PXE 2.1 and AMT 11.0 Physical specifications Feature Description Dimensions (W x H x D) 100 x 338 x 381 mm (3.95 x 13.3 x 15 in) Social and environmental Specification Description Eco-Label Certifications and Declarations This product is low halogen except for power cords, cables and peripherals. Service parts obtained after purchase may not be Low Halogen. ENERGY STAR (energy-saving features available on selected configurations -Windows only) US Federal Energy Management Program (FEMP) China Energy Conservation Program (CECP) IT ECO declaration Batteries The battery in this product complies with EU Directive 2006/66/EC Battery size: CR2032 (coin cell) Battery type: Lithium Metal The battery in this product does not contain: Mercury greater than 5ppm by weight Cadmium greater than 10ppm by weight Lead greater than 40ppm by weight Restricted material usage Restricted Material Usage This product meets the material restrictions specified in HP's General Specification for the Environment. HP is committed to compliance with all applicable environmental laws and regulations, including the European Union Restriction of Hazardous Substances (RoHS) Directive. HP's goal is to exceed compliance obligations by meeting the requirements of the RoHS Directive on a worldwide basis. Low halogen statement This product is low halogen except for power cords, cables and peripherals, as well as the following customer-configurable internal components: Creative Recon3D PCIe Audio Card is not Low Halogen. Service parts obtained after purchase may not be Low Halogen. End-of-Life management and recycling HP offers end-of-life HP product return and recycling programs in many geographic areas. To recycle your product, please go to: http://www.hp.com/recycle or contact your nearest HP sales office. Products returned to HP will be recycled, recovered or disposed of in a responsible manner. This product is greater than 90% recyclable by weight when properly disposed of at end of life. Additional information This HP product is designed to comply with the Waste Electrical and Electronic Equipment (WEEE) Directive - 2002/96/EC. Plastic parts weighing over 25 grams used in the product are marked per ISO 11469 and ISO1043. This product is >90% recycle-able when properly disposed of at end of life EPEAT Gold registered in the U.S. EPEAT registration varies by country. Packaging HP Workstation product packaging meets the HP General Specification Does not contain restricted substances listed in HP Standard 011-1 General Specification for the Environment Does not contain ozone-depleting substances (ODS) Does not contain heavy metals (lead, mercury, cadmium or hexavalent chromium) in excess of 100 ppm sum total for all heavy metals listed Maximizes the use of post-consumer recycled content materials in packaging materials All packaging material is recyclable All packaging material is designed for ease of disassembly Reduced size and weight of packages to improve transportation fuel efficiency Plastic packaging materials are marked according to ISO 11469 and DIN 6120 standards formatting Internal Cushions made from fabricated recycled expanded-polyethylene (EPE) or recycled expanded-polypropylene (EPP). May also be made from recycled molded paper-pulp (MPP). External Carton made from corrugated fiberboard with at least 25% recycled content.
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